Taiwan's smartphone IC shipments reached 116.97 million units in the third quarter of 2009, up 30.9% sequentially, and market value amounted to US$613.7 million, up 32.0% sequentially, according to Taipei-based Market Intelligence & Consulting Institute (MIC). In the third quarter of 2009, sales of the Apple iPhone 3GS far exceeded expectations, and sales are expected to reach 10 million in the fourth quarter of 2009. iPhone chip suppliers have benefited from this development. Furthermore, other terminal vendors made advance procurements to prepare for the peak season in the fourth quarter.
Regarding baseband and RF transceivers, CDMA (including EVDO) market volume in the third quarter reached 1.39 million units, accounting for 10.4% of the total, as several new models of HTC (Hero, Desire) were officially launched by US operators Verizon and Sprint and as the Palm Pre continued shipments. Terminal products using EDGE chips are gradually retreating from the market mainstream. However, due to shipments of the EDGE version mini 3i series, manufactured by Foxconn and aimed at the Chinese market, EDGE chip market volume grew to 562,000 units in the third quarter, and its share of the total amounted to 4.2%. HSPA share fell to 85.1%, but HSPA chip market volume still reached 11.37 million units, a new high.
As for suppliers' market shares, smartphones of Taiwan manufacturers still mainly adopt baseband and RF transceivers of Infineon, which benefited from the Apple iPhone series, and Qualcomm.
Regarding power amplifiers (PAs), Taiwan smartphone PA chip market volume in the third quarter of 2009 reached 48.59 million units. TriQuint still had the largest market share in this segment, as it is a main supplier of 2G PAs for HTC and 3G PAs for Apple.
As for application processors (APs), "Samsung is currently the largest supplier in the market, as it supplies for the Apple iPhone series models," said MIC industry analyst Edward Lin. "However, TI, which has exited from the baseband business and now focuses on AP development, has rolled out the OMAP 3430 series, which adopts the Cortex A8 architecture and features a clock speed of 1GHz. This offers processor options other than Qualcomm, enabling terminal vendors to pair together different communications systems, and it has been well received by many brand-name vendors, such as HTC, Palm etc. As a result, TI's share in the Taiwanese smartphone AP market increased in the third quarter of 2009."
天线孔径调谐对于智能手机至关重要，可保证其在不断增加的 RF 频段范围内有效运行并支持向 5G 的过渡。智能手机需要更多天线来支持不断增长的 RF 需求，例如新的 5G 频段、MIMO，和载波聚合（CA）等。而由于智能手机工业设计潮流的不断变化，留给这些天线的空间越来越少；于是，天线也因此变得越来越小，潜在降低了其效率和带宽。孔径调谐手段允许天线在多个频带上有效地调谐，将 Tx 和 Rx 性能提高 3dB 以上，从而补偿这一问题。
天线效率在智能手机的整体 RF 性能中发挥着至关重要的作用。然而，当前的智能手机工业设计趋势和 RF 需求（尤其是即将过渡至 5G），意味着智能手机必须要将更多的天线安装到更小的空间内，并且/或者提高现有天线的带宽。